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1. Metrics for Measuring Productivity of Flexible-Sequence Cluster Tools
John Dismukes (University of Toledo) john.dismukes@utoledo.edu
2. Intrinsic Equipment Efficiency (IEE) Methodology and Tools to Increase Throughput
Christian Reh (Infineon Technologies) Christian.reh@infineon.com
3. Utilizing SEMI Equipment Standards to Obtain Accurate Equipment Performance Date
for OEE Improvement Lisa Pivin (Intel Corporation) lisa.m.pivin@intel.com
1. On a Motion Control Problem for a Placement Machine
Nguyen Van Hop (Thammasat University) vanhop@siit.tu.ac.th
2. Modeling of Waviness Reduction in Silicon Wafer Grinding by Finite Element Method
ZJ Pei (Kansas State University) zpei@ksu.edu
3. A Predictive Model for the Grinding Mark Patterns in Semiconductor Wafer Grinding
Somasundaram Chidambaram & ZJ Pei (Kansas State University) sch8888@ksu.edu
Tae-Eog Lee (KAIST) telee@mail.kaist.ac.kr
2. Case Studies in Improving Equipment Productivity in Wafer Fabs using ToolSim
Kishore Potti & Manuel Aybar (Texas Instruments, Inc.) k-potti1@ti.com
3. Using Simulation to Understand and Improve Process Tool Efficiency
Keith Pare (AMD Saxony Manufacturing GmbH) and Todd LeBaron (Brooks Automation) keith.pare@amd.com todd_lebaron@brooks.com
1. E-Diagnostics: A Secure and Cost-Effective Method to Increase Equipment Availability
Anant Raman (Intel Corporation) anant.raman@intel.com
2. Asset Optimization through Web-Enabled, Collaborative Process Management
Joseph LaChapelle (Egsoft, A Division of Electroglas, Inc.) clynch@electroglas.com