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1. Spelunking in the Data Mine: On Data Mining as an Analysis Tool for the Optimization of Microprocessor Speed
Kevin Anderson kevin.c.anderson@intel.com
2. Using Clustering to Produce and Intuitive Solution for Multivariate Analysis
Nechama Katan (Intel) Nechama.n.katan@intel.com
3. Application of Multivariate Reduced-Rank Statistical Methods to the Monitoring of Spatial Uniformity of Wafer Etching
Michael Nikolaou (University of Houston) nikolaou@uh.edu
4. Cluster Analysis, What, Why, How
John Plummer (Consultant) johplummer@aol.com
1. A modularized yield enhancement system in semiconductor manufacturing
Fei-Long Chen (National Tsing Hua University) flchen@ie.nthu.edu.tw
2. Neural Network Models for Error Classification and Manufacturing Yield Forecasting
Armin Schels (Infineon) armin.schels@infineon.com
3. Basic Area Dependency Yield Model
Stephen A. Whitlock (Agere) swhitlock@agere.com
4. Impact of Process Variation on Circuit Performance
Steven A. Eastman (Intel) steve.eastman@intel.com
1. Harnessing the Fourth Dimension for Semiconductor SPC
Rob Firmin (Foliage Software Systems, Inc.) rfirmin@foliage.com
2. Spatial Outlier Methods for Detecting Defects in Semiconductor Devices at Electrical Probe
James Stanley (Motorola), James.D.Stanley@motorola.com
3. The Global Process Control Methodology
Francois Lemaire (Si Automation) f.lemaire@siautomation.com
1. Reducing/Eliminating Outgoing Testing
Ed Russell (Cypress Semiconductor) elr@cypress.com
2. Determining Cost Benefits for Less Than 100% Inspection
Don McCormack (International SEMATECH) don.mccormack@sematech.org
3. A Breakthrough Statistical Simulation Methodology: The Business Quality's Solution Enabler for Manufacturing Leadership (Soon Keong Chew (Intel) soon.keong.chew@intel.com ) CANCELLED
1. Calibration Procedure for an Optical Thickness Measurement Tool: A Case Study
Simona Spadoni (STMicroelectronics) simona.spadoni@st.com
2. Components of Variation: A Case Study Where the Software Failed
Diana Ballard (Cypress Semiconductor) dhb@cypress.com
3. Application of Statistical Methods for Analysis of DC- and AC- Voltammetric Data for ECD Copper Metallization Process
Aleksander Jaworski (Technic, Inc.) alekjawor@aol.com
Sherry Cui (Motorola) Sherry.Cui@motorola.com
2. Statistical Methods Application at Varian Semiconductor Equipment Associated, Inc
Jane Ferrara (Varian Semiconductor) jane.ferrara@vsea.com
3.Testing Two Variance Components Models
Diane K. Michelson (International Sematech) di.michelson@sematech.org