INTRODUCTION
In the last few decades, miniaturization has been an important aspect in the development of technology. Smaller components make the systems faster, more reliable, cheaper and capable of incorporating more complex functions. These miniature parts also tend to be rugged, respond rapidly, use little power, occupy a small volume, and are often much less expensive than conventional macro parts. One of the main goals of miniaturization through microengineering is to be able to integrate the well-developed technology in microelectronic circuitry into the novel technology in micromachined three-dimensional structures, in order to produce completely integrated Micro-Electro-Mechanical Systems (MEMS).
The field of MEMS is extremely broad, including applications such as pressure and acceleration sensors, scanning probe tips for atomic force microscopes, flow sensors, valves, micro motors, and chemical analysis on a chip. Many MEMS are geometrically complicated, electro-mechanically coupled, and inherently three-dimensional. The solution of multi-domain physics problems includes electrical, mechanical, magnetic, thermal, and fluidic effects, which need to be accurately simulated to correctly predict device performance.
In addition, the integrated circuit fabrication techniques widely used today in the manufacturing of MEMS require the modeling of complex material behavior and processing such as oxidation, etching, deposition, and diffusion. Although there have been a number of recent efforts to develop simulation based design tools for MEMS, this emerging field must also draw on numerous disciplines in order to develop the need capability. The strategy in advancing MEMS technologies is to continue the movement toward greater levels of integration. The motivation is to reduce cost, achieve unprecedented levels of system functionality, and to push further the performance to levels enabling vast new application areas.
The primary goal of the workshop was to bring together researchers from a variety of backgrounds to exchange ideas and discuss technical challenges that must be met to advance the technologies and applications of MEMS, as well as to discuss research opportunities for collaboration among experts in MEMS manufacturing. This workshop provided a forum for researchers from academia, government and industry and was comprised of presentations of technical position papers submitted by the delegates, as well as breakout session discussions on collaboration opportunities and the relevant emerging research topics in MEMS.
A total of thirty-six delegates participated in this one-day workshop. Three critical areas: (a) MEMS fabrication, (b) MEMS applications and (c) MEMS packaging and reliability, were selected in this workshop. After the general presentation, the participants were divided into three working group, and each group focused on one focal area. Although the recommendations of each group were reported separately, there was a large degree of consensus among the three working groups despite the breadth of the subject area and the diversity of backgrounds and interests represented by the participants.
The field of MEMS manufacturing is vast, and it is impossible to cover all topics in a one-day workshop. However, every effort was made to include contemporary topics of significant importance to MEMS manufactures, as well as those that would benefit from research done at universities or in collaboration with universities. Moreover, research funding opportunities related to MEMS manufacturing do exist throughout NSF and other government agencies. While programs exist, especially in NSF, in small and disparate modes, optimal impact is only possible if a concerted and coordinated effort is initiated, which embraces new paradigms and combines them with the relevant portions of existing programs. It was one the purpose of this workshop to provide input into this overall process. We hope that this report will serve this purpose.